Raw wafer
| Wafer type | Description |
| Test wafer (8"/12") | covering the technology node of 0.3um, 0.2um, 0.16um, 0.09um, 0.06um, 0.037um and 0.026um |
| Dummy wafer (8"/12") | Dummy wafer from world top wafer suppliers |
| SIC Substrate (6"/8") | Ultra P, P, D grade |
| SIC Epi/Device wafer (6") | 6" N/N+As (notch 100) EPI and Device wafer |
| GaN wafer (6"/8") | Different substrate for GaN Epi and Device wafers |
Spare parts and Comsumble material_ in Assembly process
Key parts
Item
| Description | Photos |
| Caplliary | From world top suppliers including SPT, Micro-Swiss and GAISER Both standard and BTNK type are provided to cover different design and application | 
|
| Rubber tip | Excellent resistance to abrasion, not easy to back sticky, no Stains, no crumbs and no mark Stable ESD resistance Heat resistance: 150℃, 350℃ Minmum tip size 0.07mm, vacuum hold size 0.1mm Different shape by applicatons. |  |
| Grinding Wheel | Possible to grind wafer up to 17um thickness Excellent die strength, roughness and edge performance. Outstanding grinding ability for TSV and Nomral compound wafer Wide application as Disco wheel replacement |  |
| Saw blade | Wide blade witdh range to cover different application Minimized chipping performance Improve productivity by high feed speed better capability on Anti-Ni-corroision, slant cut |  |
Disco Parts
| Spinner table, chuck table, Bellow, Flange, BBD /NCS AMP sensor , UV Lamp, CCD camera, flow meter etc |  |
Auxillary system | Taping/De-taping system, Wafer expander, Wafer Mounter, UV irradiation system, CO2 bubbler, Diama flow dispenser. |  |
| Jig/Tape | Metal Cassette, Anti-ESD Cassette, Ring, Grinding and cutting tape |  |
Spare parts and Comsumble material_ in Foundry process
--Chiller and Heat Exchanger applied in Dry Etching, Thin film, IMP. Key parameters listed as bellow
| Item | Chiller | Heat Exchanger |
| Temperature range | -20℃-90℃ | -70℃-250℃ |
Control Accuracy
| ± 0.01℃~±0.1℃
| ± 0.01℃~±0.1℃
|
| Power | 3KW~10KW | 200W~200KW |
--Local scrubber for Gas disposition generated in Etching, Thin film and IMP process
--PVD Target, Vacumm Pump, RF Generator, Gate Valver, Showerhead, E-Chuck, Heater, MFC etc. applied in semiconductor equipment suppliers like AMAT/Lam/TEL
--CMP Total solutions
| Item | Description | Photos |
| Slurry | Copper slurry, Barrier Slurry, Dielectric slurry, Tungsten
slurry. Applied in Tier one Foundry already |  |
Post CMP
clean | Effective removal of particle and residues after W,Al,Cu,SiN
polishing.
Remove by-products on Pads, extenstion of pad lifetime
and surface defect reduction on polised wafer. |
Slurry
Central
Supply | Professional Slurry Supply system | 
|
| Parts | Pad, Conditioner, Brush | 
|
Process Tools
| Application | Function | Description |
| Foundry | CVD/PVD/CMP/Furnace/Etch/WET Etch, Scrubber Clean | 6"/8"/12" Refurbished process tools |
| Foundry | CD-SEM, Thickness measurement, Profile Measurement | Offer Both new and Refurbished metrology tools |
| Assembly | Wafer Saw | 6"/8"/12" both new and refurbished tools Basic Function wiht multiple piece cutting, Auto focus, Pattern recognition, Alignment. Optional Functions include NCS, Kerf check, Blade breakage detection，working piece recognition. |
| Lab | Failure analysis and Reliability | Nano probing, FIB, SEM, OM THS, TC, HAST standard chamber and test kits. Customized thermo stressing application system |